CLEARFIL S3 BOND PLUS Self-etching adhesive - Kuraray
CLEARFIL S3 BOND PLUS Self-etching adhesive - Kuraray - is backordered and will ship as soon as it is back in stock.
Livraison et expédition
Livraison et expédition
Mode d'expédition :
- France Point Relais
- Livraison Province lendemain avant 13h
- Livraison Province lendemain avant 18h
- Paris livraison en cabinet exclusivement
- Livraison locale - Île-de-France ( Petite couronne )
Retrait sur place :
Évitez les frais de livraison pour vos petites commandes en venant les récupérer directement dans nos locaux, au 10 rue Parmentier, 93100 Montreuil.
Description
Description
CLEARFIL™ S³ BOND PLUS is a one-step adhesive suitable for many applications, from bonding direct restorations to cavity sealing or various uses during procedures involving posts and abutments. Its design is based on clinically tested CLEARFIL™ S³ BOND technology. The etching, preparation and bonding steps are carried out during a treatment involving a single layer and a single liquid.
Fundamental versatility
CLEARFIL™ S³ BOND PLUS also has a fluoride releasing property. Combined with a simple and quick application procedure, this one-step adhesive will meet the expectations of dental practitioners with its excellent adhesion strength in different clinical situations, such as the treatment of children or reconstructions of stumps with CLEARFIL™ DC CORE PLUS.
CLEARFIL™ S³ BOND PLUS is indicated for the following uses:
- Direct light-cured composite resin restorations
- Sealing cavities in pretreatment of indirect restorations
- Treatment of exposed root surfaces
- Sealing of posts and reconstruction of stumps using dual polymerization composite resin
- Intraoral repairs of fractured ceramic, hybrid ceramic or composite resin restorations
- Reconstructions of stumps in photopolymerizable composite resin
- Surface treatment of prosthetic restorations made of ceramic, hybrid ceramic or composite resin
- Surface treatment of dental posts
Fewer steps, fewer errors
Collage can be so easy! CLEARFIL™ S³ BOND PLUS eliminates many time-consuming and error-prone work steps, such as shaking the bottle, mixing and applying multiple components precisely, applying multiple layers and rubbing into tooth structure. It offers a short application time and a simple procedure which reduces the number of technical errors that can occur during application. In short, CLEARFIL™ S³ BOND PLUS guarantees high error tolerance while creating excellent bond strength to enamel and dentin.
Strong adhesion guaranteed
The high-performance initiator of CLEARFIL™ S³ BOND technology generates more active radicals than a conventional initiator. This unique technology improves clinical performance while minimizing the risk of potential practitioner errors during application, such as insufficient distance between the light-curing unit and the bonding surface.
In addition, this unique technology increases the polymerization ratio and makes the bonding more stable against water. This phenomenon guarantees users the excellent long-term performance characteristics of Kuraray Noritake products.
Always ready, very quickly prepared
CLEARFIL™ S³ BOND PLUS is always ready for immediate use, in just three steps: Apply, air dry, light cure – in less than 30 seconds!
- Apply a drop of glue (no mixing, no stirring)
- Apply the glue to the cavity wall for 10 seconds (without rubbing)
- Dry with gentle airflow for 5+ seconds (only one application required)
- Light cure for 10 seconds
Paiement & sécurité
Modes de paiement
Vos informations de paiement sont traitées de manière sécurisée. Nous ne stockons pas les détails de votre carte de crédit et n'avons pas accès aux informations de votre carte de crédit.


